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- [77호: Tech-Insight] End-to-End Interconnect Co-simulation with “optiSLang” End-to-End Interconnect Co-simulation with “optiSLang” 이강표 매니저 태성에스엔이 kplee@tsne.co.kr Ansys optiSLang [그림 1]과 같이 이 프로그램은 PIDO (Process Integration Design Optimization) Tool로 Process Integration은 시뮬레이션 과정을
- AI 솔루션 기반 광 모듈 Benefits of Co-Packaged optics (CPO) - Reduces power consuption by up to 50% - Enables terabit-scale Silicon Photnics for AI Workloads - Low-power, high-speed interconnects (800G) - Dense Optical Integration
- Mercedes G63 AMG 4,0l with 585HP, 2020 function Sound System with nine Speaker ONLINE Navigation System Live Traffic Information Smart phone integration Direct steering Rain-sensing Wipers Cruise Co.......
- 스마트 친환경 건축 buildings-with-kinetic-facades-elements-for-environmental-control/ In today’s conversation around “smart” architecture, the integration These buildings, ostensibly “dumb” as co.......
- Motorola & Burton Snowboards Embarking on a long term wireless integration collaboration, Burton Snowboards and Motorola Inc. recently end result is a series of three technologically advanced Burton Audex Snowboard Jackets with wireless co