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- TSMC의 5.5mm 레티클 CoWoS, 99% 이상 수율 달성… AI 병목 현상으로 메모리 및 ABF 지적 급증하는 첨단 패키징 수요 속에서 TSMC의 첨단 패키징 기술 및 서비스 부문 부사장인 준 허(Jun He)는 오늘 열린 2026 OCP APAC 서밋에서 회사의 최신 CoWoS(Chip-on-Wafer-on-Substrate
- ENERPAC Calls on KLES, Locking in an Even Stronger Global Partnership At 11:00 a.m. on Thursday, July 2, ENERPAC officials called on KLES once again. visit was arranged by Phil Jefferson, the newly appointed EVP and Chief Commercial Officer of ENERPAC APAC
- GE Energy, Technical Program Manager Reporting to the APAC SWS Operations Manager, the Technical Program Manager position is primarily project End-to-end responsibility of projects to meet the schedule, cost and quality commitments. • Anticipate on-time